Qianli Magnetic Middle Layer BGA Reballing Platform for iPhone 14 Series

Marca: OTHER

Código de producto: E05IQWEQ8B

0 Opiniones | Escribe una reseña |

€59

(IVA / IVA incluido)

En stock

Envío

− +

Envío rápido

Garantía de 1 año

Almacén de la UE

IVA de la UE incluido

Descripción

1. Middle frame reballing platform, precise positioning for the motherboard in high precision, strong magnetic pressing with no bulge

2. To show the beauty of design in a compact shape, motherboard reballing without worry is compact and easy, saving space

3. Magnet sliding dislocation design, smart application of the sliding dislocation design, easy to take

4. CNC high-precision integrated processing, stable positioning for the motherboard, no deviation in reballing

5. Strong magnetic attraction, accurate positioning no offset, and encountering high-temperature magnetism will not weaken

6. High-temperature magnetic strong pressing prevents the stencils from bulging caused by high-temperature

UPC/EAN:

Score